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HD64F38024HV Datasheet, PDF (36/684 Pages) Renesas Technology Corp – Hardware Manual Renesas 8-Bit Single-Chip Microcomputer H8 Family/H8/300L Super Low Power Series
Section 1 Overview
Table 1.2 Bonding Pad Coordinates of HCD64338024, HCD64338023, HCD64338022,
HCD64338021, and HCD64338020
Pad No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
Pad Name
AVCC
P13/TMIG
P14/IRQ4/ADTRG
P16
P17/IRQ3/TMIF
X1
X2
AVSS
VSS
OSC2
OSC1
TEST
RES
P50/WKP0/SEG1
P51/WKP1/SEG2
P52/WKP2/SEG3
P53/WKP3/SEG4
P54/WKP4/SEG5
P55/WKP5/SEG6
P56/WKP6/SEG7
P57/WKP7/SEG8
P60/SEG9
P61/SEG10
P62/SEG11
P63/SEG12
P64/SEG13
P65/SEG14
P66/SEG15
P67/SEG16
P70/SEG17
P71/SEG18
P72/SEG19
P73/SEG20
P74/SEG21
P75/SEG22
P76/SEG23
P77/SEG24
P80/SEG25
P81/SEG26
P82/SEG27
P83/SEG28
Coordinates
X (μm) Y (μm)
–1870 1546
–1870 1274
–1870 1058
–1870 909
–1870 759
–1870 608
–1870 475
–1870 304
–1870 173
–1870 –10
–1870 –150
–1870 –290
–1870 –425
–1870 –560
–1870 –695
–1870 –831
–1870 –966
–1870 –1101
–1870 –1236
–1870 –1379
–1870 –1561
–1780 –1872
–1621 –1872
–1037 –1872
–896
–1872
–765
–1872
–635
–1872
–502
–1872
–371
–1872
–239
–1872
–108
–1872
23
–1872
156
–1872
287
–1872
419
–1872
550
–1872
682
–1872
833
–1872
1040
–1872
1621
–1872
1782
–1872
Pad No.
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
Pad Name
P84/SEG29
P85/SEG30
P86/SEG31
P87/SEG32
PA3/COM4
PA2/COM3
PA1/COM2
PA0/COM1
V3
V2
V1
VCC
VSS
P90/PWM1
P91/PWM2
P92
P93
P94
P95
IRQAEC
P30/UD
P31/TMOFL
P32/TMOFH
P33
P34
P35
P36/AEVH
P37/AEVL
P40/SCK32
P41/RXD32
P42/TXD32
P43/IRQ0
PB0/AN0
PB1/AN1
PB2/AN2
PB3/AN3/IRQ1/TMIC
PB4/AN4
PB5/AN5
PB6/AN6
PB7/AN7
Coordinates
X (μm) Y (μm)
1870
–1571
1870
–1395
1870
–1251
1870
–1111
1870
–970
1870
–831
1870
–691
1870
–550
1870
–410
1870
–270
1870
–131
1870
10
1870
150
1870
293
1870
489
1870
685
1870
880
1870
1076
1870
1274
1870
1546
1782
1872
1621
1872
1084
1872
948
1872
810
1872
673
1872
536
1872
311
1872
176
1872
38
1872
–99
1872
–234
1872
–482
1872
–614
1872
–745
1872
–878
1872
–1008 1872
–1148 1872
–1621 1872
–1782 1872
Note:
VSS Pads (No. 8 and 9) should be connected to power supply lines.
TEST Pad (No. 12) should be connected to VSS.
If the pad of these aren’t connected to the power supply line, the LSI will not operate correctly. These values show the
coordinates of the centers of pads. The accuracy is ±5 μm. The home-point position is the chip’s center and the center
is located at half the distance between the upper and lower pads and left and right pads.
Rev. 8.00 Mar. 09, 2010 Page 14 of 658
REJ09B0042-0800