82583V Datasheet, PDF (361/374 Pages) Intel Corporation – Intel® 82583V GbE Controller

Thermal Design Considerations—82583V GbE Controller
12.14
Note:
PCB Guidelines
The following general PCB design guidelines are recommended to maximize the thermal
performance of QFN packages:
1. When connecting ground (thermal) vias-to the ground planes, do not use thermal-
relief patterns.
2. Thermal-relief patterns are designed to limit heat transfer between the vias and the
copper planes, thus constricting the heat flow path from the component to the
ground planes in the PCB.
3. As board temperature also has an effect on the thermal performance of the
package, avoid placing 82583V adjacent to high power dissipation devices.
4. If airflow exists, locate the components in the mainstream of the airflow path for
maximum thermal performance. Avoid placing the components downstream,
behind larger devices or devices that obstruct the air flow or supply excessively
heated air.
The previously mentioned guidelines are not all inclusive and are defined to give
known, good design practices to maximize the thermal performance of the
components.
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