82583V Datasheet, PDF (355/374 Pages) Intel Corporation – Intel® 82583V GbE Controller

Thermal Design Considerations—82583V GbE Controller
12.5
12.6
Table 59.
• The component die temperature depends on the following:
— Component power dissipation
— Size
— Packaging materials (effective thermal conductivity)
— Type of interconnection to the substrate and motherboard
— Presence of a thermal cooling solution
— Thermal conductivity
— Power density of the substrate/package, nearby components, and circuit board
that is attached to it
Technology trends continue to push these parameters toward increased performance
levels (higher operating speeds), I/O density (smaller packages), and silicon density
(more transistors). Power density increases and thermal cooling solution space and
airflow become more constrained as operating frequencies increase and packaging
sizes decrease. These issues result in an increased emphasis on the following:
• Package and thermal enhancement technology to remove heat from the device.
• System design to reduce local ambient temperatures and ensure that thermal
design requirements are met for each component in the system.
Packaging Terminology
The following is a list of packaging terminology used in this section:
• Quad Flat No Leads - Plastic encapsulated package with a copper leadframe
substrate. Package uses perimeter lands on the bottom of the package to provide
electrical contact to the PCB. This package is also known as QFN.
• Junction - Refers to a P-N junction on the silicon. In this section, it is used as a
temperature reference point (for example, Theta JA refers to the junction to
ambient temperature).
• Ambient - Refers to local ambient temperature of the bulk air approaching the
component. It can be measured by placing a thermocouple approximately one inch
upstream from the component edge.
• Lands - The pads on the PCB that the BGA balls are soldered to.
• PCB - Printed Circuit Board.
• Printed Circuit Assembly (PCA) - An assembled PCB.
• Thermal Design Power (TDP) - The estimated maximum possible/expected power
generated in a component by a realistic application. Use the maximum power
requirement numbers from Table 59.
• LFM - Linear Feet per Minute (airflow)
Product Package Thermal Specification
Package Thermal Characteristics in Standard JEDEC Environment
Package Type
9 mm-64 QFN
Est. Power
(TDP)
473 mW
Θ_JA
39.5 ^°C/W
Ψ_JT
0.7 ^°C/W
TJ Max
120 ^°C
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