82583V Datasheet, PDF (346/374 Pages) Intel Corporation – Intel® 82583V GbE Controller

82583V GbE Controller—Design Considerations
11.8
11.8.1
Warning:
11.8.2
7. Proceed with normal operation
8. Re-enable could be done by driving high the DEV_OFF_N signal, followed later by
bus enumeration.
82583V Exposed Pad*
Introduction
The 82583V is a 64-pin, 9 x 9 QFN package with an Exposed-Pad*. The Exposed-Pad*
is a central pad on the bottom of the package that provides the primary heat removal
path as well as electrical grounding for a Printed Circuit Board (PCB).
In order to maximize both the removal of heat from the package and the electrical
performance, a landing pattern must be incorporated on the PCB within the footprint of
the package corresponding to the exposed metal pad or exposed heat slug on the
package. The size of the landing pattern can be larger, smaller, or even take on a
different shape than the Exposed-Pad* on the package. However, the solderable area,
as defined by the solder mask, should be at least the same size/shape as the Exposed-
Pad* on the package to maximize the thermal/electrical performance.
While the landing pattern on the PCB provides a means of heat transfer/electrical
grounding from the package to the board through a solder joint, thermal vias are
necessary to effectively conduct from the surface of the PCB to the ground plane(s).
The number of vias are application specific and dependent upon the package power
dissipation as well as electrical conductivity requirements. As a result, thermal and
electrical analysis and/or testing are recommended to determine the minimum number
needed.
Make sure that the 82583V has a good connection to ground. Check for solder voids on
the Exposed Pad,* solder wicking, or a complete lack of solder. Failure to ensure a good
connection to ground can result in functional failure.
The remainder of this section describes the silkscreen/component pads, solder mask,
solder paste, and two potential landing patterns that can be used for the 82583V
package. Note that these potential landing patterns have been used successfully in past
designs, however no particular landing pattern is recommended. Please work with your
manufacturer and assembler to ensure a process that is reliable.
Component Pad, Solder Mask and Solder Paste
Figure 61, Figure 62, and Figure 63 show the silkscreen/components pad, solder mask
and solder paste area for the 82583V package.
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