82583V Datasheet, PDF (350/374 Pages) Intel Corporation – Intel® 82583V GbE Controller

82583V GbE Controller—Design Considerations
11.9
Assembly Process Flow
Figure 66 shows the typical process flow for mounting packages to the PCB.
Figure 66. Assembly Flow
11.10
Reflow Guidelines
The typical reflow profile consists of four sections. In the preheat section, the PCB
assembly should be preheated at the rate of 1 to 2 °C/sec to start the solvent
evaporation and to avoid thermal shock. The assembly should then be thermally
soaked for 60 to 120 seconds to remove solder paste volatiles and for activation of flux.
The reflow section of the profile, the time above liquidus should be between 45 to 60
seconds with a peak temperature in the range of 245 to 250 °C, and the duration at the
peak should not exceed 30 seconds. Finally, the assembly should undergo cool down in
the fourth section of the profile. A typical profile band is provided in Figure 67, in which
220 °C is referred to as an approximation of the liquidus point. The actual profile
parameters depend upon the solder paste used and specific recommendations from the
solder paste manufacturers should be followed.
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