82583V Datasheet, PDF (356/374 Pages) Intel Corporation – Intel® 82583V GbE Controller

82583V GbE Controller—Thermal Design Considerations
Note:
12.7
Table 60.
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The thermal parameters listed in Table 59 are based on simulated results of packages
assembled on a 4-layer 30 x 56 mm mini PCIe board connected to a system board in a
natural convection environment. The maximum case temperature is based on the
maximum junction temperature and defined by the relationship, Tcase-max = Tjmax -
(Ψ_JT x Power) where Ψ_JT is the junction-to-package top thermal characterization
parameter. Θ_JA is the package junction-to-air thermal resistance.
Thermal Specifications
To ensure proper operation and reliability of the 82583V, the thermal solution must
maintain a case temperature at or below the values specified in Table 60. System-level
or component-level thermal enhancements are required to dissipate the generated heat
if the case temperature exceeds the maximum temperatures listed in Table 60.
Good system airflow is critical to dissipate the highest possible thermal power. The size
and number of fans, vents, and/or ducts, and, their placement in relation to
components and airflow channels within the system determine airflow. Acoustic noise
constraints might limit the size and types of fans, vents and ducts that can be used in a
particular design.
To develop a reliable, cost-effective thermal solution, all of the system variables must
be considered. Use system-level thermal characteristics and simulations to account for
individual component thermal requirements.
82583V Preliminary Thermal Absolute Maximum Rating
Parameter
Maximum
Tcase¹
109 °C
1. Tcase is defined as the maximum case temperature without any thermal enhancement to the package.
12.7.1
Case Temperature
The 82583V is designed to operate properly as long as the Tcase is not exceeded.
Section 12.12 describes the proper guidelines for measuring case temperature.
12.7.2
Designing for Thermal Performance
Section 12.14 describes the PCB and system design recommendations required to
achieve the required 82583V thermal performance.
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