82583V Datasheet, PDF (348/374 Pages) Intel Corporation – Intel® 82583V GbE Controller

82583V GbE Controller—Design Considerations
0.12 in.
0.30 mm
0.12 in.
0.30 mm
0.054 in. (1.38 mm) Square x 9
Figure 63.
82583V Solder Paste
The stencil for the solder paste should be 5 mils thick. Also, use a solder paste alloy
consisting of 96.5Sn/3Ag/0.5Cu for a lead free process.
11.8.3
Landing Pattern A (No Via In Pad)
This landing pattern (vias outside Exposed Pad*) provides an extended ground
connection, adequate solder coverage and less solder voiding; however, it does not
provide thermal relief. This landing pattern also meets Intel’s recommendation for
coverage >= 80%.
Extended Ground Connection
Without Thermal Relief
Metal Pattern
Solder Mask Opening
Figure 64.
82583V Landing Pattern A (Top View - Vias on the Outside of the Exposed
Pad*)
Use 12 vias distributed on four sides (three per side, as shown in Figure 64) or three
sides (four per side). Additional vias can be added to improve conductivity. If larger
vias can be used (14 to 20 mil finished hole size), then a minimum of 9 vias can be
evenly placed around the extended ground connection.
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