HD6433044 Datasheet, PDF (14/867 Pages) Hitachi Semiconductor – Hitachi Single-Chip Microcomputer

19.5.2 Division Control Register (DIVCR) ............................................................... 639
19.5.3 Usage Notes .................................................................................................... 640
Section 20 Power-Down State .................................................................................... 641
20.1 Overview......................................................................................................................... 641
20.2 Register Configuration.................................................................................................... 643
20.2.1 System Control Register (SYSCR)................................................................. 643
20.2.2 Module Standby Control Register (MSTCR) ................................................. 645
20.3 Sleep Mode ..................................................................................................................... 647
20.3.1 Transition to Sleep Mode................................................................................ 647
20.3.2 Exit from Sleep Mode..................................................................................... 647
20.4 Software Standby Mode ................................................................................................. 648
20.4.1 Transition to Software Standby Mode ............................................................ 648
20.4.2 Exit from Software Standby Mode ................................................................. 648
20.4.3 Selection of Waiting Time for Exit from Software Standby Mode ................ 649
20.4.4 Sample Application of Software Standby Mode ............................................ 650
20.4.5 Note................................................................................................................. 650
20.5 Hardware Standby Mode ................................................................................................ 651
20.5.1 Transition to Hardware Standby Mode........................................................... 651
20.5.2 Exit from Hardware Standby Mode................................................................ 651
20.5.3 Timing for Hardware Standby Mode.............................................................. 651
20.6 Module Standby Function............................................................................................... 652
20.6.1 Module Standby Timing ................................................................................. 652
20.6.2 Read/Write in Module Standby ...................................................................... 652
20.6.3 Usage Notes .................................................................................................... 652
20.7 System Clock Output Disabling Function ...................................................................... 653
Section 21 Electrical Characteristics ........................................................................ 649
21.1 Absolute Maximum Ratings ........................................................................................... 649
21.2 Electrical Characteristics of Masked ROM and PROM Versions................................... 650
21.2.1 DC Characteristics .......................................................................................... 650
21.2.2 AC Characteristics .......................................................................................... 658
21.2.3 A/D Conversion Characteristics ..................................................................... 666
21.2.4 D/A Conversion Characteristics ..................................................................... 667
21.3 Electrical Characteristics of Flash Memory Version ...................................................... 668
21.3.1 DC Characteristics .......................................................................................... 668
21.3.2 AC Characteristics .......................................................................................... 677
21.3.3 A/D Conversion Characteristics ..................................................................... 683
21.3.4 D/A Conversion Characteristics ..................................................................... 684
21.3.5 Flash Memory Characteristics ........................................................................ 685
21.4 Operational Timing......................................................................................................... 686
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