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XC3S100E_06 Datasheet, PDF (82/231 Pages) Xilinx, Inc – Configurable Logic Block (CLB)
Functional Description
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In many systems, the 3.3V supply feeding the FPGA's
VCCO_2 input is valid before the FPGA's other VCCINT and
VCCAUX supplies, and consequently, there is no issue. How-
3.3V Supply
ever, if the 3.3V supply feeding the FPGA's VCCO_2 supply
is last in the sequence, a potential race occurs between the
FPGA and the SPI Flash PROM, as shown in Figure 55.
SPI Flash cannot be selected
SPI Flash PROM
minimum voltage
FPGA VCCO_2 minimum
Power On Reset Voltage
(VCCO2T)
SPI Flash
PROM CS
delay (tVSL)
SPI Flash available for
read operations
SPI Flash PROM must
be ready for FPGA
access, otherwise delay
FPGA configuration
(VCCINT, VCCAUX
already valid)
FPGA initializes configuration
memory (TPOR)
FPGA accesses
SPI Flash PROM
Time
DS312-2_50b_110206
Figure 55: SPI Flash PROM/FPGA Power-On Timing if 3.3V Supply is Last in Power-On Sequence
If the FPGA's VCCINT and VCCAUX supplies are already
valid, then the FPGA waits for VCCO_2 to reach its mini-
mum threshold voltage before starting configuration. This
threshold voltage is labeled as VCCO2T in Table 73 of Mod-
ule 3 and ranges from approximately 0.4V to 1.0V, substan-
tially lower than the SPI Flash PROM's minimum voltage.
Once all three FPGA supplies reach their respective Power
On Reset (POR) thresholds, the FPGA starts the configura-
tion process and begins initializing its internal configuration
memory. Initialization requires approximately 1 ms (TPOR,
minimum in Table 110 of Module 3, after which the FPGA
de-asserts INIT_B, selects the SPI Flash PROM, and starts
sending the appropriate read command. The SPI Flash
PROM must be ready for read operations at this time. Spar-
tan-3E FPGAs issue the read command just once. If the SPI
Flash is not ready, then the FPGA does not properly config-
ure.
If the 3.3V supply is last in the sequence and does not ramp
fast enough, or if the SPI Flash PROM cannot be ready
when required by the FPGA, delay the FPGA configuration
process by holding either the FPGA's PROG_B input or
INIT_B input Low, as highlighted in Figure 54. Release the
FPGA when the SPI Flash PROM is ready. For example, a
simple R-C delay circuit attached to the INIT_B pin forces
the FPGA to wait for a preselected amount of time. Alter-
nately, a Power Good signal from the 3.3V supply or a sys-
tem reset signal accomplishes the same purpose. Use an
open-drain or open-collector output when driving PROG_B
or INIT_B.
SPI Flash PROM Density Requirements
Table 56 shows the smallest usable SPI Flash PROM to
program a single Spartan-3E FPGA. Commercially avail-
able SPI Flash PROMs range in density from 1 Mbit to 128
Mbits. A multiple-FPGA daisy-chained application requires
a SPI Flash PROM large enough to contain the sum of the
FPGA file sizes. An application can also use a larger-den-
sity SPI Flash PROM to hold additional data beyond just
FPGA configuration data. For example, the SPI Flash
PROM can also store application code for a MicroBlaze™
RISC processor core integrated in the Spartan-3E FPGA.
See Using the SPI Flash Interface after Configuration.
Table 56: Number of Bits to Program a Spartan-3E
FPGA and Smallest SPI Flash PROM
Device
Number of
Configuration
Bits
Smallest Usable
SPI Flash PROM
XC3S100E
581,344
1 Mbit
XC3S250E
1,353,728
2 Mbit
XC3S500E
2,270,208
4 Mbit
XC3S1200E
3,841,184
4 Mbit
XC3S1600E
5,969,696
8 Mbit
CCLK Frequency
In SPI Flash mode, the FPGA’s internal oscillator generates
the configuration clock frequency. The FPGA provides this
clock on its CCLK output pin, driving the PROM’s clock
input pin. The FPGA starts configuration at its lowest fre-
quency and increases its frequency for the remainder of the
configuration process if so specified in the configuration bit-
stream. The maximum frequency is specified using the
ConfigRate bitstream generator option. The maximum fre-
quency supported by the FPGA configuration logic depends
on the timing for the SPI Flash device. Without examining
the timing for a specific SPI Flash PROM, use
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DS312-2 (v3.4) November 9, 2006
Product Specification