DRA790 Datasheet, PDF (433/436 Pages) Texas Instruments – Infotainment Applications Processor

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DRA790, DRA791
DRA793, DRA797
SPRS968A – AUGUST 2016 – REVISED FEBRUARY 2017
9 Mechanical Packaging and Orderable Information
The following pages include mechanical packaging and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and
revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
9.1 Mechanical Data
The device package has been specially engineered with a technology called Via Channel. The Via
Channel Array technology allows larger than normal PCB via sizes, reduces the number of PCB signal
layers required in a PCB design with this package, and will substantially reduce PCB costs compared to a
full array 0.65mm pitch package.
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Mechanical Packaging and Orderable Information 433
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