DRA790 Datasheet, PDF (152/436 Pages) Texas Instruments – Infotainment Applications Processor

DRA790, DRA791
DRA793, DRA797
SPRS968A – AUGUST 2016 – REVISED FEBRUARY 2017
www.ti.com
Table 5-13. Dual Voltage LVCMOS DC Electrical Characteristics (continued)
over operating free-air temperature range (unless otherwise noted)
PARAMETER
MIN
NOM
MAX
UNIT
I_{IN with pulldown}
enabled
I_{IN with pullup}
enabled
C_PAD
Z_O
Input current at each I/O pin with weak pulldown
enabled measured when PAD = VDDS
Input current at each I/O pin with weak pullup
enabled measured when PAD = 0
Pad capacitance (including package capacitance)
Output impedance (drive strength)
40
100
200
µA
10
100
290
µA
4
pF
40
Ω
(1) VDDS in this table stands for corresponding power supply. For more information on the power supply name and the corresponding ball,
see Table 4-1, POWER [11] column.
5.7.1 USBPHY DC Electrical Characteristics
NOTE
USB1 instance is compliant with the USB3.0 SuperSpeed Transmitter and Receiver
Normative Electrical Parameters as defined in the USB3.0 Specification Rev 1.0 dated Jun 6,
2011.
NOTE
USB1 and USB2 Electrical Characteristics are compliant with USB2.0 Specification Rev 2.0
dated April 27, 2000 including ECNs and Errata as applicable.
5.7.2 HDMIPHY DC Electrical Characteristics
NOTE
The HDMIPHY DC Electrical Characteristics are compliant with the HDMI 1.4a specification
and are not reproduced here.
5.7.3 PCIEPHY DC Electrical Characteristics
NOTE
The PCIe interfaces are compliant with the electrical parameters specified in PCI Express®
Base Specification Revision 3.0.
5.8 Thermal Resistance Characteristics for CBD Package
For reliability and operability concerns, the maximum junction temperature of the Device has to be at or
below the T_J value identified in Section 5.4, Recommended Operating Conditions.
A BCI compact thermal model for this Device is available and recommended for use when modeling
thermal performance in a system.
Therefore, it is recommended to perform thermal simulations at the system level with the worst case
device power consumption.
5.8.1 Package Thermal Characteristics
NOTE TO USERS:
NOTE
The content of this section is UNDER DEVELOPMENT!
152 Specifications
Copyright © 2016–2017, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: DRA790 DRA791 DRA793 DRA797