82870P2P64H2 Datasheet, PDF (212/217 Pages) –

Ballout and Package Information
R
Figure 28. 567-Ball FCBGA Solder Balls Detail
0.74 + 0.025
Detail J
Scale 5:1
0.100 + 0.025
FC BGA Substrate
H
UNDERFILL
EPOXY
DIE SOLDER
BUMPS
DIE
J
1.940 + 0.150
NOTE: Dimensions in millimeters.
Detail H
Scale 5:1
1.100 + 0.100
0.600 + 0.100
BGA Solder Balls
Pkg_FCBGA_Solderballs
212
Intel^® 82870P2 P64H2 Datasheet