S912XHY128F0VLM Datasheet, PDF (722/802 Pages) Freescale Semiconductor, Inc – S12 Microcontrollers

Electrical Characteristics
Table A-4. Operating Conditions
Voltage difference V_DDR to V_DDX
Voltage difference V_LCD to V_DDX
Voltage difference V_LCD to V_SSX
Voltage difference V_SSX to V_SSA
Voltage difference V_SS1 , V_SS2 , V_SS3 , V_SSPLL to V_SSX
Digital logic supply voltage²
PLL supply voltage
Oscillator³ (Loop Controlled Pierce)
∆_VDDR
∆_VLCDVDDR
∆_VLCDVSSX
∆_VSSX
∆_VSS
V_DD
V_DDPLL
f_osc
-0.1
-
-0.25
-0.1
1.72
1.72
4
0
0.1
-
0.25
-
-
refer to Table A-12
0
0.1
1.8
1.98
1.8
1.98
—
16
V
V
V
V
V
V
MHz
Bus frequency⁴
f_bus
0.5
—
40
MHz
Temperature Option C
Operating junction temperature range
Operating ambient temperature range⁵
TJ
–40
—
TA
–40
27
°C
85
Temperature Option V
Operating junction temperature range
Operating ambient temperature range⁵
°C
TJ
–40
—
TA
–40
27
105
Temperature Option M
°C
Operating junction temperature range
Operating ambient temperature range⁵
TJ
–40
—
150
TA
–40
27
125
1 ^{LCD/Motor Driver pad can only be work under >4.5V}
2 ^{The device contains an internal voltage regulator to generate the logic and PLL supply out of the I/O supply.}
3 ^{This refers to the oscillator base frequency. Typical crystal & resonator tolerances are supported.}
4 ^{Please refer to Table A-22 for maximum bus frequency limits with frequency modulation enabled}
5 ^{Please refer to Section A.1.8, “Power Dissipation and Thermal Characteristics” for more details about the relation between}
ambient temperature T_A and device junction temperature T_J.
NOTE
Using the internal voltage regulator, operation is guaranteed in a power
down until a low voltage reset assertion.
A.1.8 Power Dissipation and Thermal Characteristics
Power dissipation and thermal characteristics are closely related. The user must assure that the maximum
operating junction temperature is not exceeded. The average chip-junction temperature (T_J) in °C can be
obtained from:
TJ = TA + (PD • Θ_JA)
TJ = Junction Temperature, [°C ]
TA = Ambient Temperature, [°C ]
PD = Total Chip Power Dissipation, [W]
Θ_JA = Package Thermal Resistance, [°C/W]
MC9S12XHY-Family Reference Manual, Rev. 1.01
722
Freescale Semiconductor