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| TCI6630K2L Datasheet, PDF (295/298 Pages) Texas Instruments – Multicore DSP+ARM KeyStone II System-on-Chip | |||
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TCI6630K2L
SPRS893E â MAY 2013 â REVISED JANUARY 2015
12 Mechanical Data
12.1 Thermal Data
Table 12-1 shows the thermal resistance characteristics for the PBGA - CMS 900-pin mechanical
package.
NO.
1 RθJC
2 RθJB
Table 12-1. Thermal Resistance Characteristics (PBGA Package) CMS
Junction-to-case
Junction-to-board
°C/W
.405
3.44
12.2 Packaging Information
The following packaging information reflects the most current released data available for the designated
device(s). This data is subject to change without notice and without revision of this document.
Copyright © 2013â2015, Texas Instruments Incorporated
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Product Folder Links: TCI6630K2L
Mechanical Data 295
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