GMS30C7201 Datasheet, PDF (349/352 Pages) Hynix Semiconductor – 60MHz operation frequency Low power consumption

Electrical Characteristics
15.6 Recommended soldering conditions
Recommended Soldering Conditions
pack) that
is sensitive to moisture.
1. If the product
packed in the mois-
ture-proof bag (Dry-
2. The following treatment
is required prior to surface
mount
assembly to avoid
package cracks or reli-
ability degradation
related to mois-
ture and
thermal
stress.
bag may be stored unopened for up to 12 months
1) The dry packed
beyond
the seal
date at < 40°C and 90%
humidity (RH).
2) The contents of the bag may be stored indefinitely at < 20% RH.
3) If upon opening, the humidity indicator card show humidity
above 20%, the contents have expired and required re-baking at
125°C for 20 hours.
4) The contents of the bag must be surface mounted within 48 hours
of opening the dry bag. It is recommended the dry bag is not
opened until just prior to soldering.
5) Desiccant and humidity indicator card (HIC) contained within
dry bag.
relative
GMS30C7201 Data Sheet
15-13