MC912D60ACPVE8 Datasheet, PDF (407/460 Pages) Freescale Semiconductor, Inc – MC68HC912D60A MC68HC912D60C MC68HC912D60P Technical Data

Electrical Specifications
Tables of Data
Table 20-2. Thermal Characteristics
Characteristic
Symbol
Value
Unit
Average junction temperature
T_J
Ambient temperature
T_A
Package thermal resistance (junction-to-ambient)
80-pin quad flat pack (QFP)
Θ_JA
T_A + (P_D × Θ_JA)
User-determined
50
°C
°C
°C/W
Package thermal resistance (junction-to-ambient)
112-pin thin quad flat pack (TQFP)
Θ_JA
51
°C/W
Total power dissipation⁽¹⁾
Device internal power dissipation
I/O pin power dissipation⁽²⁾
P_D
P_INT
P_I/O
P_INT + P_I/O or
-_T---_J---₊-----^K₂---₇---₃---_°--_C--
W
I_DD × V_DD
W
User-determined
W
A constant⁽³⁾
K
P_D × (T_A + 273°C) +
Θ_JA × P_D2
W · °C
1. This is an approximate value, neglecting P_I/O.
2. For most applications P_I/O « P_INT and can be neglected.
3. K is a constant pertaining to the device. Solve for K with a known T_A and a measured P_D (at equilibrium). Use this value of
K to solve for P_D and T_J iteratively for any value of T_A.
MC68HC912D60A — Rev. 3.1
Freescale Semiconductor
Electrical Specifications
Technical Data
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