DS083 Datasheet, PDF (9/430 Pages) Xilinx, Inc – Summary of Features

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Virtex-II Pro and Virtex-II Pro X Platform FPGAs: Introduction and Overview
Virtex-II Pro Ordering Examples
Virtex-II Pro ordering examples are shown in Figure 1 (flip-chip package) and Figure 2 (Pb-free wire-bond package).
Example: XC2VP40 -7 FF 1152 C
Device Type
Speed Grade
(-5, -6, -7*)
Temperature Range:
C = Commercial (Tj = 0˚C to +85˚C)
I = Industrial* (Tj = –40˚C to +100˚C)
Number of Pins
*NOTE: -7 devices not available in Industrial grade.
Package Type
DS083_02_062104
Figure 1: Virtex-II Pro Ordering Example, Flip-Chip Package
Example: XC2VP40 -6 FG G 676 I
Device Type
Speed Grade
(-5, -6, -7*)
Temperature Range:
C = Commercial (Tj = 0˚C to +85˚C)
I = Industrial* (Tj = –40˚C to +100˚C)
*NOTE: -7 devices not available in Industrial grade.
Number of Pins
Pb-Free
Package Type
DS083-1_02b_062104
Figure 2: Virtex-II Pro Ordering Example, Pb-Free Wire-Bond Package
Virtex-II Pro X Ordering Example
A Virtex-II Pro X ordering example is shown in Figure 3.
Example: XC2VPX20 -6 FF 896 C
Device Type
Speed Grade
(-5, -6)
Temperature Range:
C = Commercial (Tj = 0°C to +85°C)
I = Industrial* (Tj = –40°C to +100°C)
Number of Pins
Package Type
DS083_02a_092705
Figure 3: Virtex-II Pro X Ordering Example, Flip-Chip Package
DS083 (v4.7) November 5, 2007
Product Specification
www.xilinx.com
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