DS083 Datasheet, PDF (198/430 Pages) Xilinx, Inc – Summary of Features

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Virtex-II Pro and Virtex-II Pro X Platform FPGAs: Pinout Information
FF672 Flip-Chip Fine-Pitch BGA Package Specifications (1.00mm pitch)
Figure 4: FF672 Flip-Chip Fine-Pitch BGA Package Specifications
FF896 Flip-Chip Fine-Pitch BGA Package
As shown in Table 9, XC2VP7, XC2VP20, and XC2VP30 Virtex-II Pro devices are available in the FF896 flip-chip fine-pitch
BGA package. Pins in each of these devices are the same, except for differences shown in the "No Connects" column.
Following this table are the FF896 Flip-Chip Fine-Pitch BGA Package Specifications (1.00mm pitch).
DS083 (v4.7) November 5, 2007
Product Specification
www.xilinx.com
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