DS083 Datasheet, PDF (72/430 Pages) Xilinx, Inc – Summary of Features

5
R 7 Virtex-II Pro and Virtex-II Pro X Platform FPGAs:
DC and Switching Characteristics
DS083 (v4.7) November 5, 2007
Product Specification
Virtex-II Pro⁽¹⁾ Electrical Characteristics
Virtex™-II Pro devices are provided in -7, -6, and -5 speed
grades, with -7 having the highest performance.
Virtex-II Pro DC and AC characteristics are specified for
both commercial and industrial grades. Except the operat-
ing temperature range or unless otherwise noted, all the DC
and AC electrical parameters are the same for a particular
speed grade (that is, the timing characteristics of a -6 speed
grade industrial device are the same as for a -6 speed grade
commercial device). However, only selected speed grades
and/or devices might be available in the industrial range.
All supply voltage and junction temperature specifications
are representative of worst-case conditions. The parame-
ters included are common to popular designs and typical
applications. Contact Xilinx for design considerations
requiring more detailed information.
All specifications are subject to change without notice.
Virtex-II Pro DC Characteristics
Table 1: Absolute Maximum Ratings
Symbol
Description⁽¹⁾
Virtex-II Pro X Virtex-II Pro Units
V_CCINT
Internal supply voltage relative to GND
–0.5 to 1.6
V
V_CCAUX Auxiliary supply voltage relative to GND
–0.5 to 3.0
V
V_CCO
Output drivers supply voltage relative to GND
–0.5 to 3.75
V
V_BATT
Key memory battery backup supply
–0.5 to 4.05
V
V_REF
Input reference voltage
–0.3 to 3.75
V
3.3V I/O input voltage relative to GND (user and dedicated I/Os)
–0.3 to 4.05⁽³⁾
V
V_IN
2.5V or below I/O input voltage relative to GND (user and dedicated I/Os)
–0.5 to V_CCO + 0.5
V
Voltage applied to 3-state 3.3V output (user and dedicated I/Os)
–0.3 to 4.05⁽³⁾
V
V_TS
Voltage applied to 3-state 2.5V or below output (user and dedicated I/Os)
–0.5 to V_CCO + 0.5
V
AVCCAUXRX Receive auxilliary supply voltage relative to GNDA (analog ground)
–0.5 to 2.0
–0.5 to 3.0
V
AVCCAUXTX Transmit auxilliary supply voltage relative to GNDA (analog ground)
–0.5 to 3.0
–0.5 to 3.0
V
V_TRX
Terminal receive supply voltage relative to GND
–0.5 to 3.0
–0.5 to 3.0
V
V_TTX
Terminal transmit supply voltage relative to GND
–0.5 to 1.6
–0.5 to 3.0
V
T_STG
Storage temperature (ambient)
–65 to +150
°C
All regular FG/FF flip-chip packages
+220
°C
T_SOL
Maximum soldering
temperature ⁽²⁾
Pb-free FGG256 wire-bond package
N/A
Pb-free FGG456 and FGG676
wire-bond packages
N/A
+260
°C
+250
°C
T_J
Maximum junction temperature⁽²⁾
+125
°C
Notes:
1. Stresses beyond those listed under Absolute Maximum Ratings might cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these or any other conditions beyond those listed under Operating Conditions
is not implied. Exposure to Absolute Maximum Ratings conditions for extended periods of time might affect device reliability.
2. For soldering guidelines and thermal considerations, see the Device Packaging and Thermal Characteristics Guide information
on the Xilinx website.
3. 3.3V I/O Absolute Maximum limit applied to DC and AC signals. Refer to XAPP659 for more details.
1. Unless otherwise noted, "Virtex-II Pro" refers to members of the Virtex-II Pro and/or Virtex-II Pro X families.
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DS083 (v4.7) November 5, 2007
Product Specification
www.xilinx.com
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