DS083 Datasheet, PDF (225/430 Pages) Xilinx, Inc – Summary of Features

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Virtex-II Pro and Virtex-II Pro X Platform FPGAs: Pinout Information
FF896 Flip-Chip Fine-Pitch BGA Package Specifications (1.00mm pitch)
Figure 5: FF896 Flip-Chip Fine-Pitch BGA Package Specifications
DS083 (v4.7) November 5, 2007
Product Specification
www.xilinx.com
Module 4 of 4
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