DS083 Datasheet, PDF (290/430 Pages) Xilinx, Inc – Summary of Features

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Virtex-II Pro and Virtex-II Pro X Platform FPGAs: Pinout Information
FF1517 Flip-Chip Fine-Pitch BGA Package
As shown in Table 12, XC2VP50 and XC2VP70 Virtex-II Pro devices are available in the FF1517 flip-chip fine-pitch BGA
package. Following this table are the FF1517 Flip-Chip Fine-Pitch BGA Package Specifications (1.00mm pitch).
Table 12: FF1517 — XC2VP50 and XC2VP70
Bank
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Pin Description
IO_L01N_0/VRP_0
IO_L01P_0/VRN_0
IO_L02N_0
IO_L02P_0
IO_L03N_0
IO_L03P_0/VREF_0
IO_L05_0/No_Pair
IO_L06N_0
IO_L06P_0
IO_L07N_0
IO_L07P_0
IO_L08N_0
IO_L08P_0
IO_L09N_0
IO_L09P_0/VREF_0
IO_L19N_0
IO_L19P_0
IO_L20N_0
IO_L20P_0
IO_L21N_0
IO_L21P_0
IO_L25N_0
IO_L25P_0
IO_L26N_0
IO_L26P_0
IO_L27N_0
IO_L27P_0/VREF_0
IO_L28N_0
IO_L28P_0
IO_L29N_0
IO_L29P_0
IO_L30N_0
IO_L30P_0
IO_L34N_0
Pin
Number
D31
E31
K30
J30
G30
H30
K28
E30
F30
C30
D30
J29
K29
G29
H29
E29
F29
L28
L27
C29
D29
H28
J28
M27
M26
D28
E28
H27
J27
J26
K26
F28
G27
D27
No Connects
XC2VP50
XC2VP70
NC
NC
NC
NC
NC
NC
NC
DS083 (v4.7) November 5, 2007
Product Specification
www.xilinx.com
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