MEC1322 Datasheet, PDF (395/456 Pages) Microchip Technology – Keyboard and Embedded Controller for Notebook PC

MEC1322
37.3 Thermal Characteristics
TABLE 37-8: THERMAL OPERATING CONDITIONS
Rating
Consumer Temperature Devices
Operating Junction Temperature Range
Operating Ambient Temperature Range - Commercial
Operating Ambient Temperature Range - Industrial
Power Dissipation:
Internal Chip Power Dissipation:
PINT = VCC1 x IVCC1 from Table 37-10
(e.g., 3.45V x 9.75mA = 33.64mW)
I/O Pin Power Dissipation:
I/O = S (({VCC1 – VOH} x IOH) + S (VOL x IOL))
Maximum Allowed Power Dissipation
Symbol Min. Typical Max. Unit
TJ
—
—
+125
°C
TA
0
—
+70
°C
TA
-40
—
+85
°C
PD
PINT + PI/O
W
PDMAX
(TJ – TA)/θJA
W
TABLE 37-9: THERMAL PACKAGING CHARACTERISTICS
Characteristics
Symbol Typical Max. Unit Notes
Package Thermal Resistance, 128-pin VTQFP
θJA
51.0
—
°C/W
1
θJC
25.0
—
°C/W
1
Package Thermal Resistance, 132-pin DQFN
θJA
28.0
—
°C/W
1
θJC
5.0
—
°C/W
1
Package Thermal Resistance, 144-pin WFBGA
θJA
50.0
—
°C/W
1
θJC
17.0
—
°C/W
1
Note 1: Junction to ambient thermal resistance, Theta-JA (θJA) and Junction to case thermal resistance, Theta-JC
(θJC) numbers are achieved by package simulations.
37.4 Power Consumption
TABLE 37-10: VCC1 SUPPLY CURRENT, I_VCC1
VCC2
VCC1
System
State
48 MHz
Ring
Oscillator
Frequency
Typical
(3.3V,
25⁰ C)
Max
Max
(3.465V, (3.465V, Units
70⁰ C) 85⁰ C)
Comments
On On
S0
48MHz
8.50
9.75
10.25 mA FULL ON, 48MHz, LPC Clock ON
On On
S0
12MHz
6.00
8.00
8.50 mA FULL ON, 12MHz, LPC Clock ON
On On
S0
3MHz
5.50
7.00
7.50 mA FULL ON, 3MHz, LPC Clock ON
On On
S0
1MHz
5.00
6.50
7.00 mA FULL ON, 1MHz, LPC Clock ON
On On
S0
12MHz
3.00
3.70
4.25 mA Heavy Sleep 1, LPC Clock ON
On On
S0
Off
0.80
1.50
2.10 mA Heavy Sleep 2, LPC Clock ON
On On
S0
Off
0.50
1.25
1.85 mA Heavy Sleep 3, LPC Clock ON
Off On
S5
48MHz
7.75
9.25
9.75 mA FULL ON (48MHz), LPC Clock Off
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DS00001719D-page 395