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| 82371AB Datasheet, PDF (276/284 Pages) Intel Corporation – PCI-TO-ISA / IDE XCELERATOR PIIX4 | |||
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82371AB (PIIX4)
E
Table 57. PIIX4 324-Pin Ball Grid Array (BGA)
Symbol
Min1
e=1.27 (solder ball pitch)
Nominal1
Max1
A
1.90 (2.06)
2.09 (2.29)
2.30 (2.52)
A1
0.50
0.60
0.70
A2
1.12
1.17
1.22
D
26.80
27.00
27.20
D1
24.00
24.70
E
26.80
27.00
27.20
E1
24.00
24.70
I
1.44 REF.
J
1.44 REF.
M2
20 (Depopulated)
N3
324
b
0.60
0.76
0.90
c
0.28 (0.44)
0.32 (0.52)
0.38 (0.60)
f
Remark
8.05 REF.
2 Layer (4 Layer)4
NOTES:
1. All dimensions are in millimeters.
2. âMâ represents the maximum solder ball matrix size.
3. âNâ represents the maximum allowable number of solder balls.
4. PIIX4 is currently shipping with only 2 layer substrate. There are currently no plans to ship 4 layer parts.
276
PRELIMINARY
4/9/97 2:23 PM PIIX4aDS
INTEL CONFIDENTIAL
(until publication date)
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