MC3S12RG128 Datasheet, PDF (513/546 Pages) Freescale Semiconductor, Inc – Microcontrollers

Appendix A Electrical Characteristics
Table A-5. Thermal Package Characteristics¹
Num C
Rating
Symbol
Min
Typ
Max
Unit
1 T Thermal Resistance LQFP112, single sided PCB²
θ_JA
–
2 T Thermal Resistance LQFP112, double sided PCB
θ_JA
–
with 2 internal planes³
3 T Junction to Board LQFP112
θ_JB
–
4 T Junction to Case LQFP112
θ_JC
–
5 T Junction to Package Top LQFP112
Ψ_JT
–
6 T Thermal Resistance QFP 80, single sided PCB
θ_JA
–
7 T Thermal Resistance QFP 80, double sided PCB with
θ_JA
–
2 internal planes
8 T Junction to Board QFP80
θ_JB
–
9 T Junction to Case QFP80
θ_JC
–
10 T Junction to Package Top QFP80
Ψ_JT
–
1 _{The values for thermal resistance are achieved by package simulations}
2 _{PC Board according to EIA/JEDEC Standard 51-3}
3 _{PC Board according to EIA/JEDEC Standard 51-7}
–
54
o_C/W
–
41
o_C/W
–
31
o_C/W
–
11
o_C/W
–
2
o_C/W
–
51
o_C/W
–
41
o_C/W
–
27
o_C/W
–
14
o_C/W
–
3
o_C/W
A.1.9 I/O Characteristics
This section describes the characteristics of all I/O pins except EXTAL, XTAL, XFC, TEST and supply
pins. All parameters are not always applicable, e.g. not all pins feature pull up/down resistances.
MC3S12RG128 Data Sheet, Rev. 1.05
Freescale Semiconductor
513