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MC68HC908AT32 Datasheet, PDF (372/378 Pages) Freescale Semiconductor, Inc – Microcontrollers | |||
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Mechanical Data
30.2 52-Pin Plastic Leaded Chip Carrier Package (Case 778)
âNâ
Y BRK
D
B
0.007 (0.18) M T LâM S N S
U
0.007 (0.18) M T LâM S N S
Z
âLâ
âMâ
W
D
52
1
V
X
VIEW DâD
G1
0.010 (0.25) S T LâM S N S
A
0.007 (0.18) M T LâM S N S
Z
R
0.007 (0.18) M T LâM S N S
C
G
E
J
VIEW S
0.004 (0.100)
âTâ SEATING
PLANE
G1
0.010 (0.25) S T LâM S N S
H
0.007 (0.18) M T LâM S N S
K1
K
F
VIEW S
0.007 (0.18) M T LâM S N S
NOTES:
1. DATUMS âLâ, âMâ, AND âNâ DETERMINED WHERE
TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT
MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE MEASURED
AT DATUM âTâ, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE
BURRS AND INTERLEAD FLASH, BUT INCLUDING
ANY MISMATCH BETWEEN THE TOP AND BOTTOM
OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE
H DIMENSION TO BE SMALLER THAN 0.025 (0.635).
INCHES
MILLIMETERS
DIM MIN MAX MIN MAX
A 0.785 0.795 19.94 20.19
B 0.785 0.795 19.94 20.19
C 0.165 0.180 4.20 4.57
E 0.090 0.110 2.29 2.79
F 0.013 0.019 0.33 0.48
G 0.050 BSC
1.27 BSC
H 0.026 0.032 0.66 0.81
J 0.020 âââ 0.51 âââ
K 0.025 âââ 0.64 âââ
R 0.750 0.756 19.05 19.20
U 0.750 0.756 19.05 19.20
V 0.042 0.048 1.07 1.21
W 0.042 0.048 1.07 1.21
X 0.042 0.056 1.07 1.42
Y âââ 0.020 âââ 0.50
Z
2_ 10_ 2_ 10_
G1 0.710 0.730 18.04 18.54
K1 0.040 âââ 1.02 âââ
MC68HC908AT32 Data Sheet, Rev. 3.1
372
Freescale Semiconductor
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