SAA7108AE Datasheet, PDF (200/208 Pages) NXP Semiconductors – HD-CODEC

NXP Semiconductors
19. Package outline
SAA7108AE; SAA7109AE
HD-CODEC
LBGA156: plastic low profile ball grid array package; 156 balls; body 15 x 15 x 1.05 mm
SOT700-1
D
BA
ball A1
index area
A ^A2
E
A₁
detail X
e1
e
1/2 e b
∅v M C A B
∅w M C
P
N
M
L
K
J
H
G
F
E
D
C
B
A
ball A1
index area
1
3
5
7
9 11 13
2
4
6
8 10 12 14
e
e2
1/2 e
y1 _C
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
b
D
E
mm 1.65 ^{0.45 1.20 0.55 15.2 15.2}
0.35 0.95 0.45 14.8 14.8
0
e
e1
1 13
5
scale
10 mm
e2
v
w
y
y1
13 0.25 0.1 0.12 0.35
C
y
X
OUTLINE
VERSION
IEC
SOT700-1
---
REFERENCES
JEDEC
JEITA
MO-192
---
EUROPEAN
PROJECTION
ISSUE DATE
01-05-11
01-11-06
Fig 75. Package outline SOT700-1 (LBGA156)
SAA7108AE_SAA7109AE_3
Product data sheet
Rev. 03 — 6 February 2007
© NXP B.V. 2007. All rights reserved.
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