XC3S5000-5FGG676C Datasheet, PDF (7/272 Pages) Xilinx, Inc – Introduction and Ordering Information

Spartan-3 FPGA Family: Introduction and Ordering Information
Table 4: Example Ordering Information
Device
XC3S50
XC3S200
Speed Grade
-4 Standard Performance
-5 High Performance⁽¹⁾
Package Type/Number of Pins
VQ(G)100 100-pin Very Thin Quad Flat Pack (VQFP)
CP(G)132⁽²⁾ 132-pin Chip-Scale Package (CSP)
Temperature Range (T_j)
C Commercial (0°C to 85°C)
I Industrial (–40°C to 100°C)
XC3S400
TQ(G)144 144-pin Thin Quad Flat Pack (TQFP)
XC3S1000
PQ(G)208 208-pin Plastic Quad Flat Pack (PQFP)
XC3S1500
FT(G)256 256-ball Fine-Pitch Thin Ball Grid Array (FTBGA)
XC3S2000
FG(G)320 320-ball Fine-Pitch Ball Grid Array (FBGA)
XC3S4000
FG(G)456 456-ball Fine-Pitch Ball Grid Array (FBGA)
XC3S5000
FG(G)676 676-ball Fine-Pitch Ball Grid Array (FBGA)
FG(G)900 900-ball Fine-Pitch Ball Grid Array (FBGA)
FG(G)1156⁽²⁾ 1156-ball Fine-Pitch Ball Grid Array (FBGA)
Notes:
1. The -5 speed grade is exclusively available in the Commercial temperature range.
2. The CP132, CPG132, FG1156, and FGG1156 packages are discontinued. See
http://www.xilinx.com/support/documentation/spartan-3_customer_notices.htm.
Revision History
Date
04/11/2003
04/24/2003
12/24/2003
07/13/2004
01/17/2005
Version
1.0
1.1
1.2
1.3
1.4
08/19/2005
1.5
04/03/2006
2.0
04/26/2006
2.1
05/25/2007
2.2
11/30/2007
2.3
06/25/2008
2.4
12/04/2009
2.5
10/29/2012
3.0
06/27/2013
3.1
Description
Initial Xilinx release.
Updated block RAM, DCM, and multiplier counts for the XC3S50.
Added the FG320 package.
Added information on Pb-free packaging options.
Referenced Spartan-3 XA Automotive FPGA families in Table 1. Added XC3S50CP132,
XC3S2000FG456, XC3S4000FG676 options to Table 3. Updated Package Marking to show mask
revision code, fabrication facility code, and process technology code.
Added package markings for BGA packages (Figure 3) and CP132/CPG132 packages (Figure 4).
Added differential (complementary single-ended) HSTL and SSTL I/O standards.
Increased number of supported single-ended and differential I/O standards.
Updated document links.
Updated Package Marking to allow for dual-marking.
Added XC3S5000 FG(G)676 to Table 3. Noted that FG(G)1156 package is being discontinued and
updated max I/O count.
Updated max I/O counts based on FG1156 discontinuation. Clarified dual mark in Package Marking.
Updated formatting and links.
CP132 and CPG132 packages are being discontinued. Added link to Spartan-3 FPGA customer
notices. Updated Table 3 with package footprint dimensions.
Added Notice of Disclaimer section. Per XCN07022, updated the discontinued FG1156 and FGG1156
package discussion throughout document. Per XCN08011, updated the discontinued CP132 and
CPG132 package discussion throughout document. Although the package is discontinued, updated
the marking on Figure 4. This product is not recommended for new designs.
Removed banner. This product IS recommended for new designs.
DS099 (v3.1) June 27, 2013
www.xilinx.com
Product Specification
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