XC3S5000-5FGG676C Datasheet, PDF (6/272 Pages) Xilinx, Inc – Introduction and Ordering Information

Spartan-3 FPGA Family: Introduction and Ordering Information
X-Ref Target - Figure 3
BGA Ball A1
Device Type
Package
Speed Grade
Temperature Range
R
SPARTAN ^R
XC3S1000^TM
FT256EGQ0525
D1234567A
4C
Mask Revision Code
Fabrication Code
Process Code
Date Code
Lot Code
DS099-1_04_050305
Figure 3: Spartan-3 FPGA BGA Package Marking Example for Part Number XC3S1000-4FT256C
X-Ref Target - Figure 4
Ball A1
3S50
Device Type
Lot Code
F12345 -0525
Date Code
PHILIPPINES
Temperature Range
Package
C5 = CP132
C5-EGQ 4C
C6 = CPG132
Speed Grade
Process Code
Mask Revision Code
Fabrication Code
DS099-1_05_092712
Figure 4: Spartan-3 FPGA CP132 and CPG132 Package Marking Example for XC3S50-4CP132C
Ordering Information
Spartan-3 FPGAs are available in both standard (Figure 5) and Pb-free (Figure 6) packaging options for all device/package
combinations. The Pb-free packages include a special ‘G’ character in the ordering code.
X-Ref Target - Figure 5
Example: XC3S50 -4 PQ 208 C
Device Type
Speed Grade
Temperature Range:
C = Commercial (T_j = 0°C to 85°C)
I = Industrial (T_j = –40°C to +100°C)
Package Type
Number of Pins
Figure 5: Standard Packaging
DS099_1_05_020711
For additional information on Pb-free packaging, see XAPP427: Implementation and Solder Reflow Guidelines for Pb-Free
Packages.
X-Ref Target - Figure 6
Example: XC3S50 -4 PQ G 208 C
Device Type
Speed Grade
Package Type
Temperature Range:
C = Commercial (T_j = 0°C to 85°C)
I = Industrial (T_j = –40°C to +100°C)
Number of Pins
Pb-free
DS099_1_06_020711
Figure 6: Pb-Free Packaging
DS099 (v3.1) June 27, 2013
www.xilinx.com
Product Specification
6