XC3S5000-5FGG676C Datasheet, PDF (127/272 Pages) Xilinx, Inc – Introduction and Ordering Information

Spartan-3 FPGA Family: Pinout Descriptions
Package Overview
Table 81 shows the 10 low-cost, space-saving production package styles for the Spartan-3 family. Each package style is
available as a standard and an environmentally-friendly lead-free (Pb-free) option. The Pb-free packages include an extra
‘G’ in the package style name. For example, the standard "VQ100" package becomes "VQG100" when ordered as the
Pb-free option. The mechanical dimensions of the standard and Pb-free packages are similar, as shown in the mechanical
drawings provided in Table 83.
Not all Spartan-3 device densities are available in all packages. However, for a specific package there is a common footprint
that supports the various devices available in that package. See the footprint diagrams that follow.
Table 81: Spartan-3 Family Package Options
Package
Leads
Type
VQ100 / VQG100
CP132 / CPG132⁽¹⁾
TQ144 / TQG144
PQ208 / PQG208
FT256 / FTG256
FG320 / FGG320
FG456 / FGG456
FG676 / FGG676
FG900 / FGG900
FG1156 / FGG1156⁽¹⁾
100
132
144
208
256
320
456
676
900
1156
Very-thin Quad Flat Pack
Chip-Scale Package
Thin Quad Flat Pack
Quad Flat Pack
Fine-pitch, Thin Ball Grid Array
Fine-pitch Ball Grid Array
Fine-pitch Ball Grid Array
Fine-pitch Ball Grid Array
Fine-pitch Ball Grid Array
Fine-pitch Ball Grid Array
Maximum
I/O
63
89
97
141
173
221
333
489
633
784
Pitch
(mm)
0.5
0.5
0.5
0.5
1.0
1.0
1.0
1.0
1.0
1.0
Footprint
(mm)
16 x 16
8x8
22 x 22
30.6 x 30.6
17 x 17
19 x 19
23 x 23
27 x 27
31 x 31
35 x 35
Height
(mm)
1.20
1.10
1.60
4.10
1.55
2.00
2.60
2.60
2.60
2.60
Notes:
1. The CP132, CPG132, FG1156, and FGG1156 packages are discontinued. See
http://www.xilinx.com/support/documentation/spartan-3_customer_notices.htm.
Selecting the Right Package Option
Spartan-3 FPGAs are available in both quad-flat pack (QFP) and ball grid array (BGA) packaging options. While QFP
packaging offers the lowest absolute cost, the BGA packages are superior in almost every other aspect, as summarized in
Table 82. Consequently, Xilinx recommends using BGA packaging whenever possible.
Table 82: Comparing Spartan-3 Device Packaging Options
Characteristic
Quad Flat-Pack (QFP)
Maximum User I/O
141
Packing Density (Logic/Area)
Good
Signal Integrity
Fair
Simultaneous Switching Output (SSO) Support
Limited
Thermal Dissipation
Fair
Minimum Printed Circuit Board (PCB) Layers
4
Hand Assembly/Rework
Possible
Ball Grid Array (BGA)
633
Better
Better
Better
Better
6
Very Difficult
DS099 (v3.1) June 27, 2013
www.xilinx.com
Product Specification
127