EP2S180F1020C4 Datasheet, PDF (722/768 Pages) Altera Corporation – Stratix II Device Handbook, Volume 1

Thermal Resistance
Table 10–4. Stratix II Device Thermal Resistance for Typical Board (Part 2 of 2)
Device
Pin
Count
Package
_JA (° C/W)
Still Air
_JA (° C/W)
100 ft./min.
_JA (° C/W)
200 ft./min.
_JA (° C/W)
400 ft./min.
_JC (° C/W)
EP2S130 780 FBGA
9.3
7.5
6.0
4.8
0.07
1,020 FBGA
8.5
6.8
5.3
4.2
0.07
1,508 FBGA
7.5
5.8
4.6
3.6
0.07
EP2S180 1,020 FBGA
8.0
6.7
5.3
4.2
0.05
1,508 FBGA
7.1
5.7
4.5
3.5
0.05
_JB (°
C/W)
1.12
1.03
1.02
0.93
0.91
Table 10–5. Board Specifications Notes (1), (2)
Pin Count
1,508
1,020
780
672
484
Package
FBGA
FBGA
FBGA
FBGA
FBGA
Signal Layers
Power/Ground
Layers
Size (mm)
12
12
100 × 100
10
10
93 × 93
9
9
89 × 89
8
8
87 × 87
7
7
83 × 83
Notes to Table 10–5:
(1) Power layer Cu thickness 35 um, Cu 90%.
(2) Signal layer Cu thickness 17 um, Cu 15%.
Table 10–6 provides _JA (junction-to-ambient thermal resistance) and _JC
(junction-to-case thermal resistance) values for Stratix II devices.
Table 10–6. Stratix II GX Device Thermal Resistance
Device
Pin
Count
EP2SGX30 780
EP2SGX60
EP2SGX90
EP2SGX130
780
1,152
1,152
1,508
1,508
Package
FBGA
FBGA
FBGA
FBGA
FBGA
FBGA
_JA (° C/W)
Still Air
_JA (° C/W)
100 ft./min.
_JA (° C/W)
200 ft./min.
_JA (° C/W)
400 ft./min.
_JC (° C/W)
11.1
8.6
7.2
6.0
0.24
10.9
8.4
6.9
5.8
0.15
9.9
7.5
6.1
5.0
0.15
9.6
7.3
5.9
4.9
0.11
9.0
6.7
5.4
4.4
0.11
8.3
6.6
5.3
4.3
0.10
10–4
Stratix II GX Device Handbook, Volume 2
Altera Corporation
May 2007