EP2S180F1020C4 Datasheet, PDF (720/768 Pages) Altera Corporation – Stratix II Device Handbook, Volume 1

Thermal Resistance
Table 10–2. Stratix II GX Devices in FBGA Packages
Device
EP2SGX30 Flip-chip FBGA
EP2SGX60 Flip-chip FBGA
Flip-chip FBGA
EP2SGX90 Flip-chip FBGA
Flip-chip FBGA
EP2SGX130 Flip-chip FBGA
Package
Pins
780
780
1,152
1,152
1,508
1,508
Thermal
Resistance
Thermal resistance values for Stratix II devices are provided for a board
that meets JDEC specifications and for a typical board. The following
values are provided:
■ _JA (°C/W) still air—Junction-to-ambient thermal resistance with no
air flow when a heat sink is not used.
■ _JA (°C/W) 100 ft./min.—Junction-to-ambient thermal resistance
with 100 ft./min. airflow when a heat sink is not used.
■ _JA (°C/W) 200 ft./min.—Junction-to-ambient thermal resistance
with 200 ft./min. airflow when a heat sink is not used.
■ _JA (°C/W) 400 ft./min.—Junction-to-ambient thermal resistance
with 400 ft./min. airflow when a heat sink is not used.
■ _JC—Junction-to-case thermal resistance for device.
■ _JB—Junction-to-board thermal resistance for device.
Tables 10–3 provides _JA (junction-to-ambient thermal resistance), _JC
(junction-to-case thermal resistance), and _JB (junction-to-board thermal
resistance) values for Stratix II devices on a board meeting JEDEC
specifications for thermal resistance calculation. The JEDEC board
specifications require two signal and two power/ground planes and are
available at www.jedec.org.
Table 10–3. Stratix II Device Thermal Resistance for Boards Meeting JEDEC Specifications (Part 1 of 2)
Device
Pin
Count
Package
_JA (° C/W)
Still Air
_JA (° C/W)
100 ft./min.
_JA (° C/W)
200 ft./min.
_JA (° C/W)
400 ft./min.
_JC (° C/W)
EP2S15 484 FBGA
13.1
11.1
9.6
672 FBGA
12.2
10.2
8.8
EP2S30 484 FBGA
12.6
10.6
9.1
672 FBGA
11.7
9.7
8.3
8.3
0.36
7.6
0.36
7.9
0.21
7.1
0.21
_JB (°
C/W)
4.19
4.09
3.72
3.35
10–2
Stratix II GX Device Handbook, Volume 2
Altera Corporation
May 2007