MC9S12GRMV1 Datasheet, PDF (1288/1292 Pages) Freescale Semiconductor, Inc – MC9S12G Family Reference Manual and Data Sheet

Package and Die Information
Die Pad
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
Table D-1. Bondpad Coordinates
Bond Post
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
Die Pad
X Coordinate
-1315.5
-1134.5
-964.5
-794.5
-660.5
-526.5
-404.5
-292.5
-190.5
-105.5
-0.5
93.5
189.5
291.5
403.5
525.5
659.5
805.5
964.5
1120.5
1242.5
1412.5
1582.5
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
Die Pad
Y Coordinate
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1347.5
-1139.5
-1022.5
-905.5
-788.5
-681.5
-574.5
Function
PB[3]
PP[0]
PP[1]
PP[2]
PP[3]
PP[4]
PP[5]
PP[6]
PP[7]
VDDX3
VSSX3
PT[7]
PT[6]
PT[5]
PT[4]
PT[3]
PT[2]
PT[1]
PT[0]
PB[4]
PB[5]
PB[6]
PB[7]
PC[0]
PC[1]
PC[2]
PC[3]
PAD[0]
PAD[8]
PAD[1]
1290
MC9S12G Family Reference Manual, Rev.1.23
Freescale Semiconductor