MC9S12GRMV1 Datasheet, PDF (1199/1292 Pages) Freescale Semiconductor, Inc – MC9S12G Family Reference Manual and Data Sheet

Electrical Characteristics
1 _{The values for thermal resistance are achieved by package simulations}
2 _{Per JEDEC JESD51-2 with the single layer board (JESD51-3) horizontal.J}
3 _{Per JEDEC JESD51-6 with the board (JESD51-7) horizontal.}
4 _{.Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured in}
simulation on the top surface of the board near the package.
5 _{Thermal resistance between the die and the case top surface as measured in simulation by the cold plate method (MIL SPEC-883}
Method 1012.1).
6 _{Thermal characterization parameter indicating the temperature difference between package top and the junction temperature per}
JEDEC JESD51-2. Ψ_JT is a useful value to use to estimate junction temperature in a steady state customer enviroment.
A.2 I/O Characteristics
This section describes the characteristics of all I/O pins except EXTAL, XTAL, TEST, and supply pins.
Table A-6. 3.3-V I/O Characteristics (Junction Temperature From –40°C To +150°C)
Conditions are 3.15 V < V_DD35 < 3.6 V junction temperature from –40°C to +150°C, unless otherwise noted
I/O Characteristics for all I/O pins except EXTAL, XTAL,TEST and supply pins.
Num C
Rating
Symbol
Min
Typ
Max
Unit
1 P Input high voltage
V_IH
0.65*V_DD35
—
—
V
2 T Input high voltage
V_IH
—
—
V_DD35+0.3
V
3 P Input low voltage
V_IL
—
—
0.35*V_DD35 V
4 T Input low voltage
V_IL
V_SS35 – 0.3
—
—
V
5 C Input hysteresis
V_HYS
0.06*V_DD35
—
0.3*V_DD35
mV
6
Input leakage current (pins in high impedance input
mode)¹ Vin = VDD35 or VSS35
I_in
P +125°C to < T_J < 150°C
-1
—
+105°C to < T_J < 125°
-0.5
—
–40°C to < T_J < 105°C
-0.4
—
µA
1
0.5
0.4
7 P Output high voltage (pins in output mode)
IOH = –1.75 mA
V_OH
V_DD35-0.4
—
—
V
8 C Output low voltage (pins in output mode)
IOL = +1.75 mA
V_OL
—
—
0.4
V
9 P Internal pull up device current
V_IH min > input voltage > V_IL max
I_PUL
-1
—
–70
µA
10 P Internal pull down device current
V_IH min > input voltage > V_IL max
I_PDH
1
—
70
µA
11 D Input capacitance
C_in
—
7
—
pF
12 T Injection current²
—
Single pin limit
Total device limit, sum of all injected currents
I_ICS
–2.5
I_ICP
–25
mA
2.5
25
1 _{Maximum leakage current occurs at maximum operating temperature. Current decreases by approximately one-half for each}
8°C to 12 C° in the temperature range from 50°C to 125°C.
2 _{Refer to Section A.1.4, “Current Injection” for more details}
Freescale Semiconductor
MC9S12G Family Reference Manual, Rev.1.23
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