S912XEG384J3VA Datasheet, PDF (1259/1324 Pages) Freescale Semiconductor, Inc – MC9S12XEP100 Reference Manual Covers MC9S12XE Family

B.1 208 MAPBGA
Appendix B Package Information
LASER MARK FOR PIN A1
IDENTIFICATION IN THIS AREA
E
X
D
X
0.2 4X
M
K
M
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 1994.
3. DIMENSION b IS MEASURED AT THE MAXIMUM
SOLDER BALL DIAMETER, PARALLEL TO DATUM
PLANE Z.
4. DATUM Z (SEATING PLANE) IS DEFINED BY THE
SPHERICAL CROWNS OF THE SOLDER BALLS.
5. PARALLELISM MEASEMENT SHALL EXCLUDE ANY
EFFECT OF MARK ON TOP SURFACE OF PACKAGE.
MILLIMETERS
DIM MIN MAX
A --- 2.00
A1 0.40 0.60
A2 1.00 1.30
b 0.50 0.70
D 17.00 BSC
E 17.00 BSC
e 1.00 BSC
S 0.50 BSC
3
208X b
0.3 M X Y Z
0.1 M Z
15X e
S
15X e
S
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
VIEW M M
METALIZED MARK FOR PIN A1
IDENTIFICATION IN THIS AREA
A ^A2
A1
5
0.2 Z
Z4
VIEW K
(ROTATED 90° CLOCKWISE)
0.2 Z 208X
CASE 1159A-01
ISSUE B
DATE 12/12/98
Figure B-1. 208MAPBGA Mechanical Dimensions
B.2 144-Pin LQFP
Freescale Semiconductor
MC9S12XE-Family Reference Manual Rev. 1.25
1259