S912XEG384J3VA Datasheet, PDF (1209/1324 Pages) Freescale Semiconductor, Inc – MC9S12XEP100 Reference Manual Covers MC9S12XE Family

Appendix A Electrical Characteristics
Table A-6. Thermal Package Characteristics (9S12XEQ512)⁽¹⁾
Num C
Rating
Symbol Min
Typ
Max Unit
LQFP144
1a D Thermal resistance single sided PCB, natural convection
θ_JA
—
—
49
°C/W
1b D Thermal resistance single sided PCB @ 200 ft/min
θ_JA
—
—
40
°C/W
2a D Thermal resistance double sided PCB
with 2 internal planes, natural convection
θ_JA
—
—
40
°C/W
2b D Thermal resistance double sided PCB
with 2 internal planes @ 200 ft/min
θ_JA
—
—
34
°C/W
3 D Junction to Board LQFP 144
4 D Junction to Case LQFP 144^2.
5 D Junction to Package Top LQFP144³
θ_JB
—
—
28
°C/W
θ_JC
—
—
9
°C/W
Ψ_JT
—
—
2
°C/W
LQFP112
6a D Thermal resistance single sided PCB, natural convection
θ_JA
—
—
50
°C/W
6b D Thermal resistance single sided PCB @ 200 ft/min
θ_JA
—
—
40
°C/W
7a D Thermal resistance double sided PCB
with 2 internal planes, natural convection
θ_JA
—
—
40
°C/W
7b D Thermal resistance double sided PCB
with 2 internal planes @ 200 ft/min
θ_JA
—
—
34
°C/W
8 D Junction to Board LQFP112
9 D Junction to Case LQFP112^2.
10 D Junction to Package Top LQFP112³
QFP80
θ_JB
—
—
28
°C/W
θ_JC
—
—
9
°C/W
Ψ_JT
—
—
2
°C/W
11a D Thermal resistance single sided PCB, natural convection
θ_JA
—
—
50
°C/W
11b D Thermal resistance single sided PCB @ 200 ft/min
θ_JA
—
—
40
°C/W
12a D Thermal resistance double sided PCB
with 2 internal planes, natural convection
θ_JA
—
—
37
°C/W
12b D Thermal resistance double sided PCB
with 2 internal planes @ 200 ft/min
θ_JA
—
—
31
°C/W
13 D Junction to Board QFP 80
θ_JB
—
—
23
°C/W
14 D Junction to Case QFP 80⁽²⁾
θ_JC
—
—
13
°C/W
15 D Junction to Package Top QFP 80⁽³⁾
Ψ_JT
—
—
3
°C/W
1. The values for thermal resistance are achieved by package simulations for the 9S12XEQ512 die.
2. Junction to case thermal resistance was simulated to be equivalent to the measured values using the cold plate technique
with the cold plate temperature used as the “case” temperature. This basic cold plate measurement technique is described
by MIL-STD 883D, Method 1012.1. This is the correct thermal metric to use to calculate thermal performance when the
package is being used with a heat sink.
3. Thermal characterization parameter Ψ_JT is the “resistance” from junction to reference point thermocouple on top center of the
case as defined in JESD51-2. Ψ_JT is a useful value to use to estimate junction temperature in a steady state customer
enviroment.
A.1.9 I/O Characteristics
Freescale Semiconductor
MC9S12XE-Family Reference Manual Rev. 1.25
1209