HD6473847RHV Datasheet, PDF (527/546 Pages) Renesas Technology Corp – Renesas 8-Bit Single-Chip Microcomputer H8 Family / H8/300L Super Low Power Series

Appendix G Bonding Pad Form
Appendix G Bonding Pad Form
Bonding area
Metallic film is visible
from here
72μm
5μm
Figure G.1 Bonding Pad Form (HCD6433802, HCD6433801, HCD6433800, HCD64338004,
HCD64338003, HCD64338002, HCD64338001, HCD64338000, HCD64F38004,
and HCD64F38002)
Rev. 7.00 Mar. 08, 2010 Page 495 of 510
REJ09B0024-0700