EP2S90F1020C5 Datasheet, PDF (731/768 Pages) Altera Corporation – Stratix II Device Handbook, Volume 1

Package Information for Stratix II & Stratix II GX Devices
1,152-Pin FBGA - Flip Chip
■ All dimensions and tolerances conform to ASME Y14.5M - 1994.
■ Controlling dimension is in millimeters.
■ Pin A1 may be indicated by an ID dot, or a special feature, in its
proximity on package surface.
Tables 10–15 and 10–16 show the package information and package
outline figure references, respectively, for the 1,152-pin FBGA packaging.
Table 10–15. 1,152-Pin FBGA Package Information
Description
Specification
Ordering code reference
F
Package acronym
FBGA
Substrate material
BT
Solder ball composition
Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC outline reference
MS-034 variation: AAR-1
Maximum lead coplanarity
0.008 inches (0.20 mm)
Weight
12.0 g
Moisture sensitivity level
Printed on moisture barrier bag
Table 10–16. 1,152-Pin FBGA Package Outline Dimensions
Symbol
Millimeters
Min.
Nom.
A
–
–
A1
0.30
–
A2
0.25
–
A3
–
–
D
35.00 BSC
E
35.00 BSC
b
0.50
0.60
e
1.00 BSC
Max.
3.50
–
3.00
2.50
0.70
Altera Corporation
May 2007
10–13
Stratix II GX Device Handbook, Volume 2