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EP2S90F1020C5 Datasheet, PDF (727/768 Pages) Altera Corporation – Stratix II Device Handbook, Volume 1 | |||
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Package Information for Stratix II & Stratix II GX Devices
780-Pin FBGA - Flip Chip
â All dimensions and tolerances conform to ASME Y14.5M - 1994.
â Controlling dimension is in millimeters.
â Pin A1 may be indicated by an ID dot, or a special feature, in its
proximity on package surface.
Tables 10â11 and 10â12 show the package information and package
outline figure references, respectively, for the 780-pin FBGA packaging.
Table 10â11. 780-Pin FBGA Package Information
Description
Ordering code reference
Package acronym
Substrate material
Solder ball composition
JEDEC outline reference
Maximum lead coplanarity
Weight
Moisture Sensitivity Level
Specification
F
FBGA
BT
Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
MS-034 variation: AAM-1
0.008 inches (0.20 mm)
8.9 g
Printed on moisture barrier bag
Table 10â12. 780-Pin FBGA Package Outline Dimensions
Symbol
A
A1
A2
A3
D
E
b
e
Min.
â
0.30
0.25
â
0.50
Millimeters
Nom.
â
â
â
â
29.00 BSC
29.00 BSC
0.60
1.00 BSC
Max.
3.50
â
3.00
2.50
0.70
Altera Corporation
May 2007
10â9
Stratix II GX Device Handbook, Volume 2
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