EP2S90F1020C5 Datasheet, PDF (721/768 Pages) Altera Corporation – Stratix II Device Handbook, Volume 1

Package Information for Stratix II & Stratix II GX Devices
Table 10–3. Stratix II Device Thermal Resistance for Boards Meeting JEDEC Specifications (Part 2 of 2)
Device
Pin
Count
Package
_JA (° C/W)
Still Air
_JA (° C/W)
100 ft./min.
_JA (° C/W)
200 ft./min.
_JA (° C/W)
400 ft./min.
_JC (° C/W)
EP2S60 484 FBGA
12.3
10.3
8.8
672 FBGA
11.4
9.4
7.8
1,020 FBGA
10.4
8.4
7.0
EP2S90 484 Hybrid
12.0
9.9
8.3
FBGA
780 FBGA
10.8
8.8
7.3
1,020 FBGA
9.2
8.2
6.8
1,508 FBGA
9.3
7.4
6.1
EP2S130 780 FBGA
10.1
8.7
7.2
1,020 FBGA
9.5
8.1
6.7
1,508 FBGA
8.6
7.3
6.0
EP2S180 1,020 FBGA
9.0
7.9
6.5
1,508 FBGA
8.1
7.1
5.8
7.5
0.13
6.7
0.13
5.9
0.13
7.1
0.07
6.1
0.09
5.7
0.10
5.0
0.10
6.0
0.07
5.5
0.07
4.8
0.07
5.4
0.05
4.7
0.05
_JB (°
C/W)
3.38
2.95
2.67
3.73
2.59
2.41
2.24
2.44
2.24
2.08
2.10
1.94
Table 10–4 provides _JA (junction-to-ambient thermal resistance), _JC
(junction-to-case thermal resistance), and _JB (junction-to-board thermal
resistance) values for Stratix II devices on a board with the information
shown in Table 10–5.
Table 10–4. Stratix II Device Thermal Resistance for Typical Board (Part 1 of 2)
Device
Pin
Count
Package
_JA (° C/W)
Still Air
_JA (° C/W)
100 ft./min.
_JA (° C/W)
200 ft./min.
_JA (° C/W)
400 ft./min.
_JC (° C/W)
EP2S15 484 FBGA
12.6
9.9
8.1
6.7
0.36
672 FBGA
11.4
8.8
7.2
5.9
0.36
EP2S30 484 FBGA
12.3
9.6
7.8
6.4
0.21
672 FBGA
11.1
8.5
6.9
5.6
0.21
EP2S60 484 FBGA
12.1
9.4
7.6
6.3
0.13
672 FBGA
10.9
8.3
6.6
5.4
0.13
1,020 FBGA
9.6
7.1
5.6
4.5
0.13
EP2S90 484 Hybrid
11.2
8.9
7.2
5.9
0.07
FBGA
780 FBGA
10.0
7.6
6.1
4.9
0.09
1,020 FBGA
9.2
6.9
5.5
4.4
0.10
1,508 FBGA
8.2
6.0
4.7
3.7
0.10
_JB (°
C/W)
2.48
2.41
2.02
1.95
1.74
1.56
1.33
2.48
1.22
1.16
1.15
Altera Corporation
May 2007
10–3
Stratix II GX Device Handbook, Volume 2