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M1AFS600-PQ208 Datasheet, PDF (86/334 Pages) Microsemi Corporation – Fusion Family of Mixed Signal FPGAs
Device Architecture
Table 2-32 • RAM512X18
Commercial Temperature Range Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V
Parameter
Description
–2 –1
Std. Units
tAS
Address setup time
0.25 0.28 0.33 ns
tAH
Address hold time
0.00 0.00 0.00 ns
tENS
REN, WEN setup time
0.09 0.10 0.12 ns
tENH
REN, WEN hold time
0.06 0.07 0.08 ns
tDS
Input data (WD) setup time
0.18 0.21 0.25 ns
tDH
Input data (WD) hold time
0.00 0.00 0.00 ns
tCKQ1
Clock High to new data valid on RD (output retained)
2.16 2.46 2.89 ns
tCKQ2
Clock High to new data valid on RD (pipelined)
0.90 1.02 1.20 ns
tC2CRWH1 Address collision clk-to-clk delay for reliable read access after write on 0.50 0.43 0.38 ns
same address—Applicable to Opening Edge
tC2CWRH1 Address collision clk-to-clk delay for reliable write access after read on 0.59 0.50 0.44 ns
same address— Applicable to Opening Edge
tRSTBQ1
RESET Low to data out Low on RD (flow-through)
0.92 1.05 1.23 ns
RESET Low to data out Low on RD (pipelined)
0.92 1.05 1.23 ns
tREMRSTB RESET removal
0.29 0.33 0.38 ns
tRECRSTB RESET recovery
1.50 1.71 2.01 ns
tMPWRSTB RESET minimum pulse width
0.21 0.24 0.29 ns
tCYC
Clock cycle time
3.23 3.68 4.32 ns
FMAX
Maximum frequency
310 272 231 MHz
Notes:
1. For more information, refer to the application note Simultaneous Read-Write Operations in Dual-Port SRAM for Flash-
Based cSoCs and FPGAs.
2. For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on page 3-9.
2-70
Revision 4