M1AFS600-PQ208 Datasheet, PDF (1/334 Pages) Microsemi Corporation – Fusion Family of Mixed Signal FPGAs

Revision 4
Fusion Family of Mixed Signal FPGAs
Features and Benefits
High-Performance Reprogrammable Flash Technology
• Advanced 130-nm, 7-Layer Metal, Flash-Based CMOS Process
• Nonvolatile, Retains Program when Powered Off
• Instant On Single-Chip Solution
• 350 MHz System Performance
Embedded Flash Memory
• User Flash Memory – 2 Mbits to 8 Mbits
– Configurable 8-, 16-, or 32-Bit Datapath
– 10 ns Access in Read-Ahead Mode
• 1 Kbit of Additional FlashROM
Integrated A/D Converter (ADC) and Analog I/O
• Up to 12-Bit Resolution and up to 600 Ksps
• Internal 2.56 V or External Reference Voltage
• ADC: Up to 30 Scalable Analog Input Channels
• High-Voltage Input Tolerance: –10.5 V to +12 V
• Current Monitor and Temperature Monitor Blocks
• Up to 10 MOSFET Gate Driver Outputs
– P- and N-Channel Power MOSFET Support
– Programmable 1, 3, 10, 30 µA, and 20 mA Drive Strengths
• ADC Accuracy is Better than 1%
On-Chip Clocking Support
• Internal 100 MHz RC Oscillator (accurate to 1%)
• Crystal Oscillator Support (32 KHz to 20 MHz)
• Programmable Real-Time Counter (RTC)
• 6 Clock Conditioning Circuits (CCCs) with 1 or 2 Integrated PLLs
– Phase Shift, Multiply/Divide, and Delay Capabilities
– Frequency: Input 1.5–350 MHz, Output 0.75–350 MHz
Low Power Consumption
• Single 3.3 V Power Supply with On-Chip 1.5 V Regulator
• Sleep and Standby Low-Power Modes
In-System Programming (ISP) and Security
• ISP with 128-Bit AES via JTAG
• FlashLock^® Designed to Protect FPGA Contents
Advanced Digital I/O
• 1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation
• Bank-Selectable I/O Voltages – Up to 5 Banks per Chip
• Single-Ended I/O Standards: LVTTL, LVCMOS
3.3 V / 2.5 V /1.8 V / 1.5 V, 3.3 V PCI / 3.3 V PCI-X, and
LVCMOS 2.5 V / 5.0 V Input
• Differential I/O Standards: LVPECL, LVDS, B-LVDS, M-LVDS
– Built-In I/O Registers
– 700 Mbps DDR Operation
• Hot-Swappable I/Os
• Programmable Output Slew Rate, Drive Strength, and Weak
Pull-Up/Down Resistor
• Pin-Compatible Packages across the Fusion^® Family
SRAMs and FIFOs
• Variable-Aspect-Ratio 4,608-Bit SRAM Blocks (×1, ×2, ×4, ×9,
and ×18 organizations available)
• True Dual-Port SRAM (except ×18)
• Programmable Embedded FIFO Control Logic
Soft ARM Cortex-M1 Fusion Devices (M1)
• ARM^® Cortex-™M1–Enabled
Pigeon Point ATCA IP Support (P1)
• Targeted to Pigeon Point^® Board Management Reference
(BMR) Starter Kits
• Designed in Partnership with Pigeon Point Systems
• ARM Cortex-M1 Enabled
MicroBlade Advanced Mezzanine Card Support (U1)
• Targeted to Advanced Mezzanine Card (AdvancedMC™ Designs)
• Designed in Partnership with MicroBlade
• 8051-Based Module Management Controller (MMC)
Table 1 • Fusion Family
Fusion Devices
ARM Cortex-M1^* Devices
AFS090
AFS250
M1AFS250
AFS600
M1AFS600
AFS1500
M1AFS1500
Pigeon Point Devices
P1AFS600
P1AFS1500
MicroBlade Devices
U1AFS250
U1AFS600
U1AFS1500
System Gates
90,000
250,000
600,000
1,500,000
General
Information
Tiles (D-flip-flops)
Secure (AES) ISP
PLLs
2,304
Yes
1
6,144
Yes
1
13,824
Yes
2
38,400
Yes
2
Globals
18
18
18
18
Flash Memory Blocks (2 Mbits)
1
1
2
4
Total Flash Memory Bits
2M
2M
4M
8M
Memory
FlashROM Bits
1,024
1,024
1,024
1,024
RAM Blocks (4,608 bits)
6
8
24
60
RAM kbits
27
36
108
270
Analog Quads
5
6
10
10
Analog Input Channels
15
18
30
30
Analog and I/Os
Gate Driver Outputs
I/O Banks (+ JTAG)
5
6
10
10
4
4
5
5
Maximum Digital I/Os
75
114
172
252
Analog I/Os
20
24
40
40
Note: *Refer to the Cortex-M1 product brief for more information.
January 2013
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© 2013 Microsemi Corporation