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M1AFS600-PQ208 Datasheet, PDF (222/334 Pages) Microsemi Corporation – Fusion Family of Mixed Signal FPGAs
Device Architecture
HSTL Class I
High-Speed Transceiver Logic is a general-purpose high-speed 1.5 V bus standard (EIA/JESD8-6).
Fusion devices support Class I. This provides a differential amplifier input buffer and a push-pull output
buffer.
Table 2-150 • Minimum and Maximum DC Input and Output Levels
HSTL
Class I
VIL
VIH
VOL
VOH
IOL IOH IOSL IOSH IIL1 IIH2
Drive
Strength
Min.
V
Max.
V
Min.
V
Max. Max.
V
V
Min.
V
Max. Max.
mA mA mA3 mA3 µA4 µA4
8 mA
–0.3 VREF – 0.1 VREF + 0.1 3.6 0.4 VCCI – 0.4 8 8 39 32 10 10
Notes:
1. IIL is the input leakage current per I/O pin over recommended operation conditions where –0.3 V < VIN < VIL.
2. IIH is the input leakage current per I/O pin over recommended operating conditions VIH < VIN < VCCI. Input current is
larger when operating outside recommended ranges.
3. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.
4. Currents are measured at 85°C junction temperature.
VTT
HSTL
Class I 50
Test Point
20 pF
Figure 2-128 • AC Loading
Table 2-151 • AC Waveforms, Measuring Points, and Capacitive Loads
Input Low (V) Input High (V) Measuring Point* (V)
VREF (typ.) (V) VTT (typ.) (V)
VREF – 0.1
VREF + 0.1
0.75
0.75
0.75
Note: *Measuring point = Vtrip. See Table 2-90 on page 2-169 for a complete table of trip points.
CLOAD (pF)
20
Timing Characteristics
Table 2-152 • HSTL Class I
Commercial Temperature Range Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V,
Worst-Case VCCI = 1.4 V, VREF = 0.75 V
Speed
Grade
tDOUT tDP
tDIN
tPY
tEOUT
tZL
tZH
tLZ
Std.
0.66 3.18 0.04 2.12 0.43 3.24 3.14
tHZ
tZLS tZHS Units
5.47 5.38 ns
–1
0.56 2.70 0.04 1.81 0.36 2.75 2.67
4.66 4.58 ns
–2
0.49 2.37 0.03 1.59 0.32 2.42 2.35
4.09 4.02 ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
2-206
Revision 4