450NX Datasheet, PDF (149/248 Pages) Intel Corporation – Intel 450NX PCIset

12.8 Intel^® 450NX PCIset Thermal Specifications
12.8 Intel^® 450NX PCIset Thermal Specifications
12.8.1 Thermal Solution Performance
The system’s thermal solution must adequately control the package temperatures below the
maximum and above the minimum specified. The performance of any thermal solution is
defined as the thermal resistance between the package and the ambient air around the part
(package to ambient). The lower the thermal resistance between the package and the ambient
air, the more efficient the thermal solution is. The required θ package to ambient is dependent
upon the maximum allowed package temperature (T_Package), the local ambient temperature
(TLA), and the package power (P_Package).
Package to ambient = (T_Package – T_LA)/P_Package
TLA is a function of the system design. Table 12-21 and Table 12-22 provide the resulting
thermal solution performance required for an Intel^® 450NX PCIset at different ambient air
temperatures around the parts.
Table 12-21: Example Thermal Solution Performance for MIOC at Package Power of 13.2 Watts
Local Ambient Temperature (TLA)
θ Package to ambient °C ⁄ (Watt)
35° C
3.79
40° C
3.41
45° C
3.03
Table 12-22: Example Thermal Solution Performance for PXB at Package Power of 7.8 Watts
Local Ambient Temperature (TLA)
θ Package to ambient °C ⁄ (Watt)
35° C
6.41
40° C
5.76
45° C
5.13
The θ package to ambient value is made up of two primary components: the thermal
resistance between the package and heatsink ( θ package to heatsink) and the thermal
resistance between the heatsink and the ambient air around the part ( θ heatsink to air). A
critical but controllable factor to decrease the value of θ package to heatsink is management of
the thermal interface between the package and heatsink. The other controllable factor
( θ heatsink to air) is determined by the design of the heatsink and airflow around the heatsink.
Intel® 450NX PCIset
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