MC912DG128ACPVE Datasheet, PDF (423/478 Pages) Freescale Semiconductor, Inc – Upward compatible with M68HC11 instruction set

Freescale Semiconductor, Inc.
Electrical Specifications
Tables of Data
Table 21-2. Thermal Characteristics
Characteristic
Symbol
Value
Unit
Average junction temperature
T_J
T_A + (P_D × Θ_JA)
°C
Ambient temperature
T_A
User-determined
°C
Package thermal resistance (junction-to-ambient)
112-pin quad flat pack (QFP)
Θ_JA
40
°C/W
Total power dissipation⁽¹⁾
P_INT + P_I/O or
P_D
------------^K-------------
W
T_J + 273°C
Device internal power dissipation
P_INT
I_DD × V_DD
W
I/O pin power dissipation⁽²⁾
P_I/O
User-determined
W
A constant⁽³⁾
K
P_D × (T_A + 273°C) + Θ_JA × P_D2
W · °C
1. This is an approximate value, neglecting P_I/O.
2. For most applications P_I/O « P_INT and can be neglected.
3. K is a constant pertaining to the device. Solve for K with a known T_A and a measured P_D (at equilibrium). Use this value of
K to solve for P_D and T_J iteratively for any value of T_A.
MC68HC912DT128A — Rev 4.0
MOTOROLA
Electrical Specifications
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Technical Data
423