MC68LC040RC25A Datasheet, PDF (349/442 Pages) Freescale Semiconductor, Inc – M68040 Users Manual

Freescale Semiconductor, Inc.
SPRING
MC68040RC25
µ
HEAT SINK
PIN GRID
ARRAY
FRAME
Figure 11-11. Heat Sink with Attachment
In the specification provided by Thermalloy, Inc., a chart illustrates the heat-sink
temperature rise above ambient versus heat dissipated. This chart applies if no airflow is
used with the heat-sink. Table 11-5 lists the calculations based on this chart.
Table 11-5. Thermal Parameters with Heat Sink and No Airflow
MHz
25
25
25
33
33
33
20
25
33
Thermal Mgmt.
Technique
Airflow Velocity
0
0
0
0
0
0
0
0
0
Defined Parameters
P_D
T_J
θ_JC
MC68040
6.3 W
110 °C
3 °C/W
6.6 W
110 °C
3 °C/W
8.6 W
110 °C
3 °C/W
7.7 W
110 °C
3 °C/W
8.0 W
110 °C
3 °C/W
10.0 W
110 °C
3 °C/W
MC68LC040 and MC68EC040
4.0 W
110 °C
3 °C/W
5.0 W
110 °C
3 °C/W
6.3 W
110 °C
3 °C/W
Heat-Sink
Spec.
T_C–T _A
Calculated
T_C
T_A
64.4 °C
66.8 °C
82.8 °C
75.6 °C
78.0 °C
94.0 °C
91.1 °C
90.2 °C
84.2 °C
86.9 °C
86.0 °C
80.0 °C
26.7 °C
23.4 °C
1.4 °C
11.3 °C
8.0 °C
–14.0 °C
45.0 °C
54.0 °C
64.4 °C
98.0 °C
95.0 °C
91.1 °C
53.0 °C
41.0 °C
26.7 °C
MOTOROLA
M68040 USER’S MANUAL
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11-21