PIC18F97J60 Datasheet, PDF (456/474 Pages) Microchip Technology – 64/80/100-Pin, High-Performance, 1 Mbit Flash Microcontrollers with Ethernet

PIC18F97J60 FAMILY
100-Lead Plastic Thin-Quad Flatpack (PF) 14x14x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
E
E1
#leads=n1
p
D1
D
B
2
1
α
n
A
c
β
φ
A2
A1
L
F
Units
INCHES
MILLIMETERS*
Dimension Limits
MIN
NOM
MAX
MIN
NOM
MAX
Number of Pins
Pitch
n
100
p
.020 BSC
100
0.50 BSC
Pins per Side
n1
25
25
Overall Height
A
.047
1.20
Molded Package Thickness
A2
.037
.039
.041
0.95
1.00
1.05
Standoff
A1
.002
.006
0.05
0.15
Foot Length
L
.018
.024
.030
0.45
0.60
0.75
Footprint
Foot Angle
F
.039 REF
1.00 REF
φ
0°
3.5°
7°
0°
3.5°
7°
Overall Width
E
.630 BSC
16.00 BSC
Overall Length
D
.630 BSC
16.00 BSC
Molded Package Width
E1
.551 BSC
14.00 BSC
Molded Package Length
D1
.551 BSC
14.00 BSC
Lead Thickness
c
.004
.008
0.09
0.20
Lead Width
B
.007
.009
.011
0.17
0.22
0.27
Mold Draft Angle Top
α
11°
12°
13°
11°
12°
13°
Mold Draft Angle Bottom
β
11°
12°
13°
11°
12°
13°
* Controlling Parameter
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
See ASME Y14.5M
REF: Reference Dimension, usually without tolerance, for information purposes only.
See ASME Y14.5M
JEDEC Equivalent: MS-026
Drawing No. C04-110
Revised 07-21-05
DS39762A-page 454
Advance Information
© 2006 Microchip Technology Inc.