PIC18F97J60 Datasheet, PDF (454/474 Pages) Microchip Technology – 64/80/100-Pin, High-Performance, 1 Mbit Flash Microcontrollers with Ethernet

PIC18F97J60 FAMILY
29.2 Package Details
The following sections give the technical details of the
packages.
64-Lead Plastic Thin-Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
E
E1
#leads=n1
p
D1 D
2
1
B
n
CH x 45°
α
A
c
φ
β
L
A1
A2
F
Units
INCHES
MILLIMETERS*
Dimension Limits
MIN
NOM
MAX
MIN
NOM
MAX
Number of Pins
n
64
Pitch
p
.020
64
0.50
Pins per Side
n1
16
16
Overall Height
A
.039
.043
.047
1.00
1.10
1.20
Molded Package Thickness
A2
.037
.039
.041
0.95
1.00
1.05
Standoff
A1
.002
.006
.010
0.05
0.15
0.25
Foot Length
L
.018
.024
.030
0.45
0.60
0.75
Footprint
Foot Angle
F
.039 REF.
1.00 REF.
φ
0
3.5
7
0
3.5
7
Overall Width
E
.463
.472
.482
11.75
12.00
12.25
Overall Length
D
.463
.472
.482
11.75
12.00
12.25
Molded Package Width
E1
.390
.394
.398
9.90
10.00
10.10
Molded Package Length
D1
.390
.394
.398
9.90
10.00
10.10
Lead Thickness
c
.005
.007
.009
0.13
0.18
0.23
Lead Width
B
.007
.009
.011
0.17
0.22
0.27
Pin 1 Corner Chamfer
CH
.025
.035
.045
0.64
0.89
1.14
Mold Draft Angle Top
α
5
10
15
5
10
15
Mold Draft Angle Bottom
β
5
10
15
5
10
15
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
REF: Reference Dimension, usually without tolerance, for information purposes only.
See ASME Y14.5M
JEDEC Equivalent: MS-026
Revised 07-22-05
Drawing No. C04-085
DS39762A-page 452
Advance Information
© 2006 Microchip Technology Inc.