PIC18F97J60 Datasheet, PDF (455/474 Pages) Microchip Technology – 64/80/100-Pin, High-Performance, 1 Mbit Flash Microcontrollers with Ethernet

PIC18F97J60 FAMILY
80-Lead Plastic Thin-Quad Flatpack (PT) 12x12x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
E
E1
#leads=n1
p
D1 D
2
B
1
n
CH x 45°
α
A
c
β
φ
A1
A2
L
F
Units
INCHES
MILLIMETERS*
Dimension Limits
MIN
NOM
MAX
MIN
NOM
MAX
Number of Pins
Pitch
n
80
p
.020 BSC
80
0.50 BSC
Pins per Side
n1
20
20
Overall Height
A
.039
.043
.047
1.00
1.10
1.20
Molded Package Thickness
A2
.037
.039
.041
0.95
1.00
1.05
Standoff
A1
.002
.004
.006
0.05
0.10
0.15
Foot Length
L
.018
.024
.030
0.45
0.60
0.75
Footprint
Foot Angle
F
.039 REF.
1.00 REF.
φ
0°
3.5°
7°
0°
3.5°
7°
Overall Width
E
.551 BSC
14.00 BSC
Overall Length
D
.551 BSC
14.00 BSC
Molded Package Width
E1
.472 BSC
12.00 BSC
Molded Package Length
D1
.472 BSC
12.00 BSC
Lead Thickness
c
.004
.006
.008
0.09
0.15
0.20
Lead Width
B
.007
.009
.011
0.17
0.22
0.27
Pin 1 Corner Chamfer
CH
.025
.035
.045
0.64
0.89
1.14
Mold Draft Angle Top
α
5°
10°
15°
5°
10°
15°
Mold Draft Angle Bottom
β
5°
10°
15°
5°
10°
15°
* Controlling Parameter
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
See ASME Y14.5M
REF: Reference Dimension, usually without tolerance, for information purposes only.
See ASME Y14.5M
JEDEC Equivalent: MS-026
Drawing No. C04-092
Revised 07-22-05
© 2006 Microchip Technology Inc.
Advance Information
DS39762A-page 453