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S9S12XS256J0CAL Datasheet, PDF (662/738 Pages) Freescale Semiconductor, Inc – Microcontrollers
Electrical Characteristics
Table A-4. Operating Conditions
Voltage difference VDDR to VDDX
∆VDDR
-0.1
0
0.1
V
Voltage difference VSSX to VSSA
∆VSSX
refer to Table A-14
Voltage difference VSS1 , VSS2 , VSS3 , VSSPLL to VSSX
Digital logic supply voltage1
∆VSS
-0.1
0
0.1
V
VDD
1.72
1.8
1.98
V
PLL supply voltage
Oscillator2 (Loop Controlled Pierce)
(Full Swing Pierce)
VDDPLL
1.72
1.8
1.98
V
fosc
4
2
—
16
MHz
—
40
Bus frequency3
fbus
0.5
—
40
MHz
Temperature Option C
Operating junction temperature range
Operating ambient temperature range4
°C
TJ
–40
—
110
TA
–40
27
85
Temperature Option V
Operating junction temperature range
Operating ambient temperature range4
°C
TJ
–40
—
130
TA
–40
27
105
Temperature Option M
°C
Operating junction temperature range
Operating ambient temperature range4
TJ
–40
—
150
TA
–40
27
125
1 The device contains an internal voltage regulator to generate the logic and PLL supply out of the I/O supply.
2 This refers to the oscillator base frequency. Typical crystal & resonator tolerances are supported.
3 Please refer to Table A-24 for maximum bus frequency limits with frequency modulation enabled
4 Please refer to Section A.1.8, “Power Dissipation and Thermal Characteristics” for more details about the relation between
ambient temperature TA and device junction temperature TJ.
NOTE
Using the internal voltage regulator, operation is guaranteed in a power
down until a low voltage reset assertion.
A.1.8 Power Dissipation and Thermal Characteristics
Power dissipation and thermal characteristics are closely related. The user must assure that the maximum
operating junction temperature is not exceeded. The average chip-junction temperature (TJ) in °C can be
obtained from:
TJ = TA + (PD • ΘJA)
TJ = Junction Temperature, [°C ]
TA = Ambient Temperature, [°C ]
PD = Total Chip Power Dissipation, [W]
ΘJA = Package Thermal Resistance, [°C/W]
S12XS Family Reference Manual, Rev. 1.13
662
Freescale Semiconductor