MC68HC708MP16 Datasheet, PDF (380/398 Pages) Freescale Semiconductor, Inc – Microcontrollers

Mechanical Specifications
22.3 Plastic Quad Flat Pack (QFP)
L
48
49
33
32
–A–
L
–B–
B
V
DETAIL A
64
17
1
16
–D–
A
0.20 (0.008) M C A–B S D S
0.05 (0.002) A–B
S
0.20 (0.008) M H A–B S D S
E
M
DETAILC
C
–C–
SEATING H
PLANE
G
–H–
DATUM
PLANE
M
0.01 (0.004)
B
B
P
–A–, –B–, –D–
DETAIL A
F
J
N
BASE
D
METAL
0.02 (0.008) M C A–B S D S
–H– DATUM
PLANE
U
T
R
Q
K
W
X
DETAIL C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –A–, –B– AND –D– TO BE DETERMINED
AT DATUM PLANE –H–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –C–.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
(0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –H–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) PER SIDE.
TOTAL IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION. DAMBAR
CANNOT BE LOCATED ON THE LOWER RADIUS
OR THE FOOT.
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 13.90 14.10 0.547 0.555
B 13.90 14.10 0.547 0.555
C 2.15 2.45 0.085 0.096
D 0.30 0.45 0.012 0.018
E 2.00 2.40 0.079 0.094
F 0.30 0.40 0.012 0.016
G
0.80 BSC
0.031 BSC
H ––– 0.25 ––– 0.010
J 0.13 0.23 0.005 0.009
K 0.65 0.95 0.026 0.037
L
12.00 REF
0.472 REF
M 5 _{_} 10_{_} 5_{_} 10_{_}
N 0.13 0.17 0.005 0.007
P
0.40 BSC
0.016 BSC
Q 0 _{_} 7_{_} 0_{_} 7_{_}
R 0.13 0.30 0.005 0.012
S 16.95 17.45 0.667 0.687
T 0.13 ––– 0.005 –––
U
0 _{_} –––
0_{_} –––
V 16.95 17.45 0.667 0.687
W 0.35 0.45 0.014 0.018
X
1.6 REF
0.063 REF
Figure 22-1. MC68HC708MP16FU (Case #840B-01)
Technical Data
380
Mechanical Specifications
MC68HC708MP16 — Rev. 3.1
Freescale Semiconductor